Gold Member Since 2016
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Zhejiang Saintyear Electronic Technologies Co., Ltd.

Silicone Gap Pad, Heat Conduction Material, Silica Gel Tablet manufacturer / supplier in China, offering Thermal Conductive Soft Silica Gel Tablet, 2.8W Thermally Conductive Gap Filler, Putty with Good Wet Ability and Reduce the Thermal Resistance and so on.

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Supplier Homepage Product Thermal Materials Thermally Conductive Gap Pad Thermal Conductive Soft Silica Gel Tablet

Thermal Conductive Soft Silica Gel Tablet

FOB Price: US $309-1,600 / Square Meter
Min. Order: 100 Square Meters
Min. Order FOB Price
100 Square Meters US $309-1,600/ Square Meter
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Port: Shanghai, China
Production Capacity: 1000000
Payment Terms: T/T
Product Catalog
Saintyear Electronic Thermal Materials
29 Products
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Basic Info
  • Model NO.: 520 Series
  • Transport Package: Carton Packing
  • Origin: Xiaoshan
  • Trademark: Saintyoo
  • Specification: 470*470mm
  • HS Code: 8473309000
Product Description
The product perfectly  combine  heat conduction performance and compliance. It is special designed for the application of gap heat transfer. The product can fill the gap and improve the heat transfer ability between the heat generation part and heat radiation part. These soft interface materials can laminate with the mating surface with minimum pressure, thus make few or no stress on the mating parts.
 
 Thermal gap pad has inherent adhesion features, dispense with adhesion layer, at the same time it can cover the microcosmic uneven surface so that make the mating parts full contact, thus improve the heat conduction efficiency. The thickness can be special customized according to the customer demand. You can also choose the products with adhesive film or single side viscosity.
 

Thermal Conductive Soft Silica Gel Tablet 
Available Configurations:
  • Standard size: 470×470 mm, can die-cut according to customers' requirements.
  • Thickness available: 0.3~8.0 mm
  • Can laminate with the adhesive film according to customer's demands.
TYPICAL PROPERTY DATA
PROPERTIESUNITS 520 SeriesTEST METHOD
Appearance-GreyVisual
Thicknessmm0.30 to 8.0ASTM D374
Thermal ConductivityW/m·k5.2ASTM D5470
Thermal Resistance@ 1mm,
20 psi
0.35 °C·in2/W
2.25 °C·cm2/W
ASTM D5470
HardnessShore OO60ASTM D2240
Flame Rating-94 V-0U.L.
Dielectric StrengthKV/mm10.0ASTM D149
Volume ResistivityΩ·cm3.0×1013ASTM D257
 ensityg/cm32.70ASTM D792
Tensile Strengthpsi50ASTM D412
Elongation%45ASTM D412
Compression Deflection
(%, at given pressure)
10 psi18ASTM D575
50 psi35
100 psi55
Dielectric Constant@1 MHz5.0ASTM D150
Service Temp.°C-60 to 200***
            
Typical Applications:
  • Desktop, laptop and peripherals
  • LED solid state lighting
  • Power source and UPS
  • Electronic telecommunication equipment
  • LCD and PDP flat panel displays
  • Automotive electronic products, battery cooling
  • Motor and engine controller
  • Energy conversion device
  • Mass storage device
  • Vibration damp application
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