Gold Member Since 2016
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Zhejiang Saintyear Electronic Technologies Co., Ltd.

Sil-Pad, Heat Conduction, Tic manufacturer / supplier in China, offering Thermal Gap Filler for Power Source and UPS, Factory Wholesale Military Grade EMI Fabric Ripstop Nickel Copper Conductive Fabric RFID Blocking Fabric for Wallets, 8.0W Thermal Conductive Silicone Pad for Gap Filling and so on.

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Supplier Homepage Product Thermal Materials Thermally Conductive Gap Pad Thermal Gap Filler for Power Source and UPS

Thermal Gap Filler for Power Source and UPS

FOB Price: US $39-200 / Square Meter
Min. Order: 100 Square Meters
Min. Order FOB Price
100 Square Meters US $39-200/ Square Meter
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Port: Shanghai, China
Production Capacity: 1000000
Payment Terms: T/T
Product Catalog
Saintyear Electronic Thermal Materials
29 Products
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Basic Info
  • Model NO.: GP200
  • Transport Package: Carton Packing
  • Origin: Xiaoshan
  • Trademark: Saintyoo
  • Specification: 470*470mm
  • HS Code: 8473309000
Product Description

 Thermal gap pad has a high degree of compliance, can achieve excellent thermal conductivity and keep economy and efficiency. It is specially designed for the application of gap heat transfer. It can fill the gap and improve the heat transfer ability between the heat generation part and heat radiation part. It can laminate with the mating surface with minimum pressure, thus make few or no stress on the mating parts.
 Thermal gap pad has a very soft surface and excellent stickiness. It will be more easily attached to the electrical components tightly, meanwhile it can cover the microcosmic uneven surface so that make the mating parts full contact, thus improve the heat conduction efficiency. The thickness can be special customized according to the customer demand. You can also choose the products with adhesive film or remove stickiness for ease of use.
 Thermal Gap Filler for Power Source and UPS
Available Configurations:
  • Standard size: 470×470 mm, can die-cut according to customers' requirements.
  • Thickness available: 0.15~15.0 mm
  • Can laminate with the adhesive film according to customer's demands.
Thicknessmm0.15 to 15.0ASTM D374
Thermal ConductivityW/m·k2.0ASTM D5470
Thermal Resistance@ 1mm,
20 psi
0.70 °C·in2/W
4.52 °C·cm2/W
ASTM D5470
HardnessShore OO45ASTM D2240
Flame Rating-94 V-0U.L.
Dielectric StrengthKV/mm10.0ASTM D149
Volume ResistivityΩ·cm2.6×1013ASTM D257
Densityg/cm32.60ASTM D792
Tensile Strengthpsi36ASTM D412
Elongation%55ASTM D412
Compression Deflection
(%, at given pressure)
10 psi9ASTM D575
50 psi33
100 psi48
Dielectrc Constant@1 MHz7.2ASTM D150
Service Temp.°C-60 to 200***
Typical Applications:
  • Desktop, laptop and peripherals
  • LED solid state lighting
  • Power source and UPS
  • Electronic telecommunication equipment
  • LCD and PDP flat panel displays
  • Automotive electronic products, battery cooling
  • Motor and engine controller
  • Energy conversion device
  • Mass storage device
  • Vibration damp application
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Miss Ivy Zhao
Oversea Sales
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